Features

The following are the key features of MSCSM170AM039CD3AG device:

• SiC Power MOSFET

– High temperature performance

• SiC Schottky Diode

– Zero reverse recovery

– Zero forward recovery

– Temperature Independent switching behavior

– Positive temperature coefficient on VF

• Kelvin emitter for easy drive

• High level of integration

• M6 power connectors

• Aluminum Nitride (AlN) substrate for improved thermal performance

Benefits

The following are the benefits of MSCSM170AM039CD3AG device:

• High efficiency converter

• Stable temperature behavior

• Direct mounting to heatsink (isolated package)

• Low junction-to-case thermal resistance

• RoHS Compliant

Applications

The following are the applications of MSCSM170AM039CD3AG device:

• Welding converters

• Switched mode power supplies

• Uninterruptible power supplies

• EV motor and traction drive

MSCSM170AM039CD3AG

Datasheet

DS00003968A-page 2