MIC5203 datasheet(4/20 Pages) MICROCHIP

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MIC5203

DS20006609A-page 4



2021 Microchip Technology Inc. and its subsidiaries

ENABLE Input

Enable Input Voltage Level

VIL

—

0.6

Logic low (off)

2.0

—

Logic low (on)

Enable Input Current

IIL

—

0.01

µA

VIL ≤ 0.6V

IIH

—

VIH ≥ 2.0V

Note 1: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total

temperature range.

2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are

tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to heat-

ing effects are covered by the thermal regulation specification.

3: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its

nominal value measured at 1V differential.

4: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current

drawn from the supply is the sum of the load current plus the ground pin current.

5: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-

tion is applied, excluding load or line regulation effects. Specifications are for a 150 mA load pulse at VIN =

16V for t = 10 ms.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Storage Temperature Range

–60

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 5s

Package Thermal Resistances

Thermal Resistance SOT-143

JA

—

250

—

°C/W

Note 2

Thermal Resistance SOT-23-5

—

220

—

°C/W

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA.

Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-

ulator will go into thermal shutdown.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VIN = VOUT +1V; IL = 1 mA; CL = 0.47 µF; VEN ≥ 2.0V; TJ = +25°C, bold values indicate

–40°C < TJ ≤ +125°C, unless noted.

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

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