For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2019 Microchip Technology Inc.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

0.30

0.20

0.80

0.00

0.25

0.40

0.90

0.02

MILLIMETERS

MIN

NOM

36

0.50

0.30

1.00

0.05

MAX

K-

0.20

-

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

4.30

6.00 BSC

4.40

4.50

Exposed Pad Corner Chamfer

Step Height

CH

A4

0.10

0.35 REF

-0.19

D3

0.060

0.035

0.085

Step Length

4.30

6.00 BSC

4.40

4.50

Microchip Technology Drawing C04-501 Rev B Sheet 2 of 2

36-Lead Very Thin Plastic Quad Flat, No Lead Package (LNX) - 6x6x1.0 mm Body [VQFN]

With 4.4 mm Exposed Pad and Stepped Wettable Flanks

LAN8670/1/2

Packaging Information

and its subsidiaries

Product Brief

DS60001536E-page 23