LT8607/LT8607B

22

Rev. D

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PACKAGE DESCRIPTION

2.00

±0.05

(4 SIDES)

2.00 SQ

±0.05

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.55

±0.05

BOTTOM VIEW—EXPOSED PAD

0.23

REF

0.335

REF

0.335 REF

0.75

±0.05

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DC8MA) DFN 0113 REV Ø

0.23

±0.05

0.45 BSC

0.25

±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.90

REF

0.23

REF

0.85

±0.05

1.8 REF

1.8 REF

2.60

±0.05

PACKAGE

OUTLINE

0.45 BSC

PIN 1 NOTCH

R = 0.15

DC8 Package

8-Lead Plastic DFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1939 Rev Ø)

Exposed Pad Variation AA