5 Pin Configuration and Functions

1

2

3

7

4

5

6

14

13

12

8

11

10

9

GND

2A2

2A1

2Y1

V

CC

15

16

1OE

1A1

1Y1

1A2

1Y2

1A3

1Y3

2OE

1Y4

2Y2

1A4

D or PW Package

20-Pin SOIC or TSSOP

Top View

1A1

1Y1

1A2

1Y2

1A3

1Y3

GND

2OE

2A2

2Y2

2A1

2Y1

1Y4

1A4

PAD

1OE

V

CC

2

3

4

5

6

7

8

15

14

13

12

11

10

9

1

16

WBQB Package

20-Pin WQFN

Top View

Pin Functions

PIN

I/O

(1)

DESCRIPTION

SOIC or

TSSOP NO.

NAME

1

1OE

I

Bank 1, output enable, active low

2

1A1

I

Bank 1, channel 1 input

3

1Y1

O

Bank 1, channel 1 output

4

1A2

I

Bank 1, channel 2 input

5

1Y2

O

Bank 1, channel 2 output

6

1A3

I

Bank 1, channel 3 input

7

1Y3

O

Bank 1, channel 3 output

8

GND

—

Ground

9

1Y4

O

Bank 1, channel 4 output

10

1A4

I

Bank 1, channel 4 input

11

2Y1

O

Bank 2, channel 1 output

12

2A1

I

Bank 2, channel 1 input

13

2Y2

O

Bank 2, channel 2 output

14

2A2

I

Bank 2, channel 2 input

15

2OE

I

Bank 2, output enable, active low

16

—

Positive supply

Thermal Pad(2)

—

The thermal pad can be connected to GND or left floating. Do not connect to any other

signal or supply.

(1)

Signal Types: I = Input, O = Output, I/O = Input or Output.

(2)

WBQB package only.

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SN74HCS367-Q1

SCLS816A – SEPTEMBER 2020 – REVISED DECEMBER 2021

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