MXD2020FF datasheet(7/8 Pages) MEMSIC

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MEMSIC MXD2020E/F Rev H

Page 7 of 8

2/26/2007

TEMPERATURE OUTPUT NOISE REDUCTION

It is recommended that a simple RC low pass filter is used

when measuring the temperature output. Temperature

output is typically a very slow changing signal, so a very

low frequency filter eliminates erroneous readings that may

result from the presence of higher frequency noise. A

simple filter is shown in Figure 6.

Filtered TOUT

8.2K

0.1uF

MEMSIC

Accel.

TOUT

Figure 6: Temperature Output Noise Reduction

POWER SUPPLY NOISE REJECTION

One capacitor is recommended for best rejection of power

supply noise (reference Figure 7 below). The capacitor

should be located as close as possible to the device supply

pin (VDD). The capacitor lead length should be as short as

possible, and surface mount capacitor is preferred. For

typical applications, the capacitor can be ceramic 0.1 μF.

VDA

VDD

MEMSIC

Accelerometer

Power Supply

0.1uF

Figure 7: Power Supply Noise Rejection

PCB LAYOUT AND FABRICATION SUGGESTIONS

1. The Sck pin should be grounded to minimize noise.

2. Liberal use of ceramic bypass capacitors is

recommended.

3. Robust low inductance ground wiring should be used.

4. Care should be taken to ensure there is “thermal

symmetry” on the PCB immediately surrounding the

MEMSIC device and that there is no significant heat

source nearby.

5. A metal ground plane should be added directly beneath

the MEMSIC device. The size of the ground plane

should be similar to the MEMSIC device’s footprint

and be as thick as possible.

6. Vias can be added symmetrically around the ground

plane. Vias increase thermal isolation of the device

from the rest of the PCB.

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