| 전자부품 데이터시트 검색엔진 |
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MDEV-433-RM 데이터시트(PDF) 3 Page - Linx Technologies |
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MDEV-433-RM 데이터시트(HTML) 3 Page - Linx Technologies |
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3 / 12 page ![]() Page 3 figure 2: Mechanical dimensions PIN DESCRIPTION Pin 1 GND Connect to common ground-plane. Pin 2 RF OUT For connection to external antenna. Output impedance is 50 Ω. Pin 3 Vcc Positive supply pin, supply voltages from +5.9 to +9 volts may be used. Pin 4 GND Connect to common ground-plane. Pin 5 DATA IN Analog or digital input. Should be driven by the same supply voltage as the module. Usually interfaced with a CMOS logic level device. Should never exceed Vcc. PHYSICAL PACKAGING The transmitter is packaged as a hybrid SIP module with five pins spaced 0.1 in. on center.The SIP package allows easy accommodation of both horizontal and vertical mounting requirements into a highly compact package. Its leaded design allows for easy prototyping and simple integration into through-hole and surface-mount designs. If the module will be bent and laid flush on the circuit board, a pad of silicon or other adhesive should be used to hold it in place. WHAT EXTERNAL COMPONENTS ARE REQUIRED ? The RM Series transmitter requires only a supply voltage, an external antenna and analog or digital input. Production adjustment or tuning is not required. |
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