MIC39300/01/02

DS20006017B-page 6



2018 - 2022 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Lead Temperature

—

—

—

260

°C

Soldering, 5 sec.

Junction Operating Temperature

Range

–40

—

+125

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Package Thermal Resistances

Thermal Resistance TO-263

—

2

—

°C/W —

Thermal Resistance TO-220

—

2

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.