date 07/08/2020

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CUI Devices

│ SERIES: CP18-M │ DESCRIPTION: PELTIER MODULE

cuidevices.com

SPECIFICATIONS

parameter

conditions/description

min

typ

max

units

solder melting temperature

connection between thermoelectric pairs

235

°C

assembly compression

0.8

MPa

RoHS

yes

MECHANICAL DRAWING

units: mm

MATERIAL

PLATING

ceramic plate

96% AL

wire leads

Ø0.25-0.3 mm

annealed copper

tin

sealer

no sealing

ceramic surface

Au plating on select models

COLD SIDE

HOT SIDE

THICKNESS

LENGTH

WIDTH

50.0±5.0

COLD SIDE

(-)

(+)

MODEL NO.

LENGTH

(mm)

WIDTH

(mm)

THICKNESS

(mm)

GOLD

PLATING HOT/

COLD SIDES

CP1881-222

8.1 ±0.3

8.1 ±0.3

2.22 ±0.15

NO

CP1881-254P

8.1 ±0.3

8.1 ±0.3

2.54 ±0.15

YES

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