MIC2033

DS20005539C-page 18

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2018 - 2022 Microchip Technology Inc. and its subsidiaries.

6-Lead UDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.10

C A B

0.05

C

(DATUM B)

(DATUM A)

C

NOTE 1

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

12

N

0.05

C A B

0.05

C A B

0.05 C

0.08 C

Microchip Technology Drawing C04-1156-HSA Rev A Sheet 1 of 2

2X

6X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

6-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HSA) - 2x2x0.6 mm Body [UDFN]

Micrel Legacy Package TDFN22-6LD-PL-1

D

E

12

N

e

6X b

E2

D2

R0.10

K

L

(A3)

A

A1

SEATING

PLANE