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IRF830ASTRLPBFA 데이터시트(PDF) 1 Page - Vishay Siliconix |
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IRF830ASTRLPBFA 데이터시트(HTML) 1 Page - Vishay Siliconix |
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1 / 10 page ![]() IRF830AS, IRF830AL, SiHF830AS, SiHF830AL www.vishay.com Vishay Siliconix S21-0901-Rev. D, 30-Aug-2021 1 Document Number: 91062 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Low gate charge Qg results in simple drive requirement • Improved gate, avalanche and dynamic dV/dt ruggedness • Fully characterized capacitance and avalanche voltage and current • Effective Coss specified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details APPLICATIONS • Switch mode power supply (SMPS) • Uninterruptible power supply • High speed power switching TYPICAL SMPS TOPOLOGIES • Two transistor forward • Half bridge and full bridge Note a. See device orientation Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. Starting TJ = 25 °C, L = 18 mH, Rg = 25 Ω, IAS = 5.0 A (see fig. 12) c. ISD ≤ 5.0 A, dI/dt ≤ 370 A/μs, VDD ≤ VDS, TJ ≤ 150 °C d. 1.6 mm from case e. Uses SiHF830A data and test conditions PRODUCT SUMMARY VDS (V) 500 RDS(on) max. ( Ω)VGS = 10 V 1.40 Qg max. (nC) 24 Qgs (nC) 6.3 Qgd (nC) 11 Configuration Single N-Channel MOSFET G D S D2PAK (TO-2 G D S I2PAK (TO-262) G D S Available Available ORDERING INFORMATION Package D2PAK (TO-263) D2PAK (TO-263) I2PAK (TO-262) Lead (Pb)-free and Halogen-free SiHF830AS-GE3 SiHF830ASTRL-GE3 a SiHF830AL-GE3 a Lead (Pb)-free IRF830ASPbF IRF830ASTRLPbF a IRF830ALPbF ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS 500 V Gate-Source Voltage VGS ± 30 Continuous Drain Current VGS at 10 V TC = 25 °C ID 5.0 A TC = 100 °C 3.2 Pulsed Drain Current a, e IDM 20 Linear Derating Factor 0.59 W/°C Single Pulse Avalanche Energy b, e EAS 230 mJ Avalanche Currenta IAR 5.0 A Repetiitive Avalanche Energy a EAR 7.4 mJ Maximum Power Dissipation TA = 25 °C PD 3.1 W TC = 25 °C 74 Peak Diode Recovery dV/dtc, e dV/dt 5.3 V/ns Operating Junction and Storage Temperature Range TJ, Tstg -55 to +150 °C Soldering Recommendations (Peak temperature) d for 10 s 300 |
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