6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Single-supply

6

V

Dual-supply

±3

Input voltage, all pins

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Input current, all pins

±10

mA

Output short circuit(2)

Continuous

Continuous

Operating temperature

–55

150

°C

Junction temperature

–55

150

°C

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single-supply

1.7

5.5

V

Dual-supply

±0.85

±2.75

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TLV387

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

187.1

°C/W

Junction-to-case(top) thermal resistance

107.4

°C/W

Junction-to-board thermal resistance

57.5

°C/W

Junction-to-top characterization parameter

33.5

°C/W

Junction-to-board characterization parameter

57.1

°C/W

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV387

SBOSA91 – DECEMBER 2021

www.ti.com

4

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: TLV387