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2017 - 2022 Microchip Technology Inc. and its subsidiaries

DS20005720B-page 7

MIC5209

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 5 sec.

Junction Temperature

–40

—

+125

°C

Junction Temperature

0

—

+125

°C

Package Thermal Resistance

Thermal Resistance SOT-223

—

62

—

°C/W EIA/JEDEC

JES51-751-7,

4 Layer Board

—

15

—

°C/W

Thermal Resistance SOIC-8

—

50

—

°C/W See Thermal

Considerations for more

information.

—

25

—

°C/W

Thermal Resistance DDPAK

—

31.4

—

°C/W EIA/JEDEC

JES51-751-7,

4 Layer Board

—

3

—

°C/W

Thermal Resistance 3 mm x 3 mm

VDFN

—

64

—

°C/W EIA/JEDEC

JES51-751-7,

4 Layer Board

—

12

—

°C/W

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.