MIC5252

DS20006579B-page 4

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2021 - 2022 Microchip Technology Inc.

Enable Input

Enable Input Logic-Low Voltage

—

—

0.4

V

shutdown

Enable Input Logic-High Voltage

1.6

—

—

V

enabled

Enable Input Current

—

0.01

1

μA

shutdown

—

0.01

1

μA

enabled

Shutdown Resistance Discharge

—

—

500

—

Ω

—

Thermal Protection

Thermal Shutdown Temperature

—

—

150

—

°C

—

Thermal Shutdown Hysteresis

—

—

10

—

°C

—

Note 1: Specification for packaged product only.

2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are

tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to

heating effects are covered by the thermal regulation specification.

3: Dropout Voltage is defined as the input-to-output differential at which the output voltage drops 2% below

its nominal value measured at 1V differential. For outputs below 2.7V, dropout voltage is the input-to-out-

put voltage differential with the minimum input voltage 2.7V. Minimum input operating voltage is 2.7V.

4: Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum

of the load current plus the ground pin current.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

—

Maximum Junction Temperature

–40

—

+125

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 5 seconds

Storage Temperature

–65

—

+150

°C

—

Package Thermal Resistance

Thermal Resistance, SOT-23

—

235

—

°C/W —

Thermal Resistance, 2x2 VDFN

—

90

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum rating. Sustained junction temperatures above that maximum can impact device reliability.