AD630

Data Sheet

Rev. G | Page 4 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±18 V

Internal Power Dissipation

600 mW

Output Short-Circuit to Ground

Indefinite

Storage Temperature

Ceramic Package

−65°C to +150°C

Plastic Package

−55°C to +125°C

Lead Temperature Range (Soldering, 10 sec)

300°C

Maximum Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 3. Thermal Resistance

Package Type

Unit

20-Lead PDIP (N-20)

24

61

°C/W

20-Lead SBDIP (D-20)

35

120

°C/W

20-Lead LCC (E-20-4)

35

120

°C/W

20-Lead SOIC_W (RW-20)

38

75

°C/W

CHIP AVAILABILITY

The AD630 is available in laser trimmed, passivated chip form.

Figure 2 shows the AD630 metallization pattern, bonding pads,

and dimensions. AD630 chips are available; consult factory for

details.

Figure 2. Chip Metallization and Pinout

Dimensions shown in inches and (millimeters)

Contact factory for latest dimensions

ESD CAUTION

14

15

16

17

18

7

8

6

5

4

19

20

1

2

3

13

12

0.089

(2.260)

0.99

(2.515)

11

10

9