A product Line of

Diodes Incorporated

40 of 51

www.diodes.com

February 2020

© Diodes Incorporated

PI3DPX1202A

Document number: DS40115 Rev 3-3

PI3DPX1202A

•

Ground referencing is highly recommended. If unavoidable, stitching capacitors of 0.1uF should be placed when reference plane

is changed.

Figure 6-7: Stitching Capacitor Placement

•

To keep the reference unchanged, stitching vias must be used when changing layers.

•

Differential pair should maintain symmetrical routing whenever possible. The intra-pair skew of micro-strip should be less than

5 mils.

•

To keep the reference unchanged, stitching vias must be used when changing layers.

•

Differential pair should maintain symmetrical routing whenever possible. The intra-pair skew of micro-strip should be less than

5 mils.

Figure 6-8: Layout Guidance of Matched Differential Pair

•

For minimal crosstalk, inter-pair spacing between two differential micro-strip pairs should be at least 20 mils or 4 times the dielec-

tric thickness of the PCB.

•

Wider trace width of each differential pair is recommended in order to minimize the loss, especially for long routing. More consis-

tent PCB impedance can be achieved by a PCB vendor if trace is wider.

•

Differential signals should be routed away from noise sources and other switching signals on the printed circuit board.