USB7056 datasheet(49/55 Pages) MICROCHIP

49 / 55 page

 2022 Microchip Technology Inc. and its subsidiaries

DS00002675F-page 49

USB7056

Note:

For the most current package drawings, see the Microchip Packaging Specification at:

http://www.microchip.com/packaging.

FIGURE 10-3:

100-VQFN PACKAGE (LAND-PATTERN)

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

8.10

MILLIMETERS

0.40 BSC

MIN

MAX

11.70

Contact Pad Length (X100)

Contact Pad Width (X100)

1.05

0.20

Microchip Technology Drawing C04-2407A

NOM

SILK SCREEN

100

Contact Pad Spacing

11.70

Contact Pad to Center Pad (X100)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

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