SC18IM700_1

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet

Rev. 01 — 28 February 2006

19 of 21

Philips Semiconductors

SC18IM700

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by

using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

16. Revision history

Table 14:

Abbreviations

Acronym

Description

ASCII

American Standard Code for Information Interchange

FIFO

First In, First Out

GPIO

General Purpose Input/Output

Inter Integrated Circuit bus

RXFIFO

Receive FIFO

TXFIFO

Transmit FIFO

UART

Universal Asynchronous Receiver/Transmitter

Table 15:

Revision history

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

SC18IM700_1

20060228

Product data sheet

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