SP9843 datasheet(2/10 Pages) SIPEX

2 / 10 page

258

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device

at these or any other above those indicated in the operation

sections of the specifications below is not implied. Exposure to

absolute maximum rating conditions for extended periods of time

may affect reliability.

DD to GND ...................................................................... -0.3V, +7V

INX to GND ............................................................................... VDD

REFL to GND ............................................................................. VDD

OUTX to GND ............................................................................ VDD

Short Circuit I

OUTX to GND ............................................ Continuous

Digital Input & Output Voltage to GND ....................................... V

Operating Temperature Range

Commercial ............................................................... 0

°C to +70°C

Extended Industrial ................................................. -40

°C to +85°C

Maximum Junction Temperature (T

J max) .......................... +150°C

Storage Temperature ................................................. -65

° to 150°C

Lead Temperature (Soldering, 10 sec) ............................... +300

°C

Package Power Dissipation .................................. (T

J max - TA)/8JA

Thermal Resistance 8

P-DIP .................................................................................. 57

°C/W

SOIC-24 .............................................................................. 70

°C/W

CAUTION:

While all input and output pins have

internal protection networks, these

parts should be considered ESD

(ElectroStatic Discharge) sensitive de-

vices. Permanent damage may occur on

unconnected devices subject to high en-

ergy electrostatic fields. Unused devices

must be stored in conductive foam or

shunts. Personnel should be properly

grounded prior to handling this device.

The protective foam should be discharged

to the destination socket before devices are

removed.

SPECIFICATIONS

DD = +5V, All VINX= 0V, VREFL = 1.625V, TA = 25° C for commercial–grade parts;

MIN ≤ TA =

MAX for industrial–grade parts; specifications apply to

all DAC's unless noted otherwise.)

PARAMETER

MIN.

TYP.

MAX.

UNITS

CONDITIONS

SIGNAL INPUTS

Input Voltage Range

3.25

DD = 4.75V, VREFL = 1.625V

Input Resistance

D = 2B

H, Code Dependent

SP9840

3.1

6.2

Ω

SP9843

1.55

3.1

Ω

Input Capacitance

Note 1

SP9840

SP9843

REFL Resistance

0.68

1.3

Ω

Note 1 and 2

REFL Capacitance

190

250

Note 1

DIGITAL INPUTS

Logic High

2.4

Logic Low

0.8

Input Current

±10

µA

Input Capacitance

Input Coding

Offset Binary

Note 3

STATIC ACCURACY

Resolution

Bits

Integral Nonlinearity

±0.75

±1.5

LSB

Note 4

Differential Nonlinearity

±0.3

±1

LSB

Note 4

Half-Scale Output Voltage

1.600

1.625

1.650

PR = LOW, V

REFL = 1.625V

Minimum Output Voltage

100

D=FF

H; ISINK = 0.1mA

Output Voltage Drift

µV/°C

PR = LOW

DYNAMIC PERFORMANCE

Multiplying Gain Bandwidth

MHz

IN(X) = 100mVP–P + 1.625V dc

Slew Rate

Measured 10% to 90%

Positive

3.0

7.9

µs

∆V = 3.2V

Negative

–3.0

–8.3

µs

∆V = –3.2V

Total Harmonic Distortion

0.003

IN(X) = 3VP–P +1.625V dc,

D=FFH; 1KHz, fLP=80KHz

Output Settling Time

0.7

µs

±1 LSB Error Band

Crosstalk

Note 5

Digital Feedthrough

nVs

D = 0

H to FFH

Wideband Noise

42.5

µVrms

OUT = 3.25V, 400Hz to 80kHz

SINAD

IN(X) = 3VP–P +1.625V dc,

D=FFH; 1KHz, fLP=80KHz

Digital Crosstalk

nVs

Note 6

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