ADUC7023BCBZ62I-R7 datasheet(95/98 Pages) AD

95 / 98 page

Data Sheet

ADuC7023

Rev. H | Page 95 of 98

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.23

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

4.45

4.30 SQ

4.25

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

P IN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 55. 40-Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-10)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

3.50 REF

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.65

3.50 SQ

3.45

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 56. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-11)

Dimensions shown in millimeters

ADUC7023BCBZ62I-R7 데이터시트(PDF) 95 Page - Analog Devices

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