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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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USB5916C/KD 데이터시트(PDF) 61 Page - Microchip Technology |
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USB5916C/KD 데이터시트(HTML) 61 Page - Microchip Technology |
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61 / 66 page  2022 Microchip Technology Inc. and its subsidiaries DS00003189C-page 59 USB5916C FIGURE 11-3: 100-VQFN PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Center Pad Width Contact Pad Spacing Center Pad Length Contact Pitch Y2 X2 8.10 8.10 MILLIMETERS 0.40 BSC MIN E MAX 11.70 Contact Pad Length (X100) Contact Pad Width (X100) Y1 X1 1.05 0.20 NOM C1 Contact Pad Spacing 11.70 Contact Pad to Contact Pad (X96) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Center Pad (X100) G1 1.28 Microchip Technology Drawing C04-2407-KD Rev C SILK SCREEN C1 EV C2 EV Y2 X2 ØV Ø0.33 E X1 Y1 G1 G2 |
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