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USB7002-I/KDX 데이터시트(PDF) 40 Page - Microchip Technology |
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USB7002-I/KDX 데이터시트(HTML) 40 Page - Microchip Technology |
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40 / 56 page ![]() USB7002 DS00002670G-page 40 2022 Microchip Technology Inc. and its subsidiaries 9.3 Package Thermal Specifications FIGURE 9-1: SUPPLY RISE TIME MODEL Note: The Power Supply Rise time requirement does not apply if the RESET_N signal is held low during power on and released after power levels rise and stabilize above the power on thresholds, or if the RESET_N signal is toggled after power supplies become stable. TABLE 9-1: PACKAGE THERMAL PARAMETERS Symbol °C/W Velocity (Meters/s) JA 19 0 16 1 JT 0.1 0 0.1 1 JC 1.3 0 1.3 1 Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. For industrial applications, the USB7002 requires multi-layer 2S4P PCB power dissipation. t10% 10% 90% Voltage TRT t90% Time 100% 3.3 V VSS VDD33 90% 100% 1.2 V VDD12 |
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