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LM5072 데이터시트(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
부품명 LM5072
상세설명  Integrated 100V Power Over Ethernet PD Interface and PWM Controller with Aux Support
PDF  24 Pages
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제조업체  NSC [National Semiconductor (TI)]
홈페이지  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM5072 데이터시트(HTML) 3 Page - National Semiconductor (TI)

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Pin Descriptions
Pin Number
Name
Description
1
RT
PWM controller oscillator frequency programming pin.
2
SS
Soft-start programming pin.
3
VIN
Positive supply pin for the PD interface and the internal PWM controller start-up regulator.
4
RCLASS
PD classification programming pin.
5
ICL_FAUX
Inrush current limit programming pin; also the front auxiliary power enable pin.
6
DCCL
PD interface DC current limit programming pin.
7
VEE
Negative supply pin for PD interface; connected to PoE and/or front auxiliary power return
path.
8
RTN
PWM controller power return; connected to the drain of the internal PD interface hot swap
MOSFET; should be externally connected to the reference ground of the PWM controller.
9
OUT
PWM controller gate driver output pin.
10
VCC
PWM controller start-up regulator output pin.
11
nPGOOD
PD interface Power Good indicator and delay timer pin; active low state indicates PoE
interface is in normal operation.
12
CS
PWM controller current sense input pin.
13
RAUX
Rear auxiliary power enable pin; can be programmed for auxiliary power dominance over
PoE power.
14
FB
PWM controller voltage feedback pin and inverting input of the internal error amplifier;
connect to ARTN to disable the error amplifier in isolated dc-dc converter applications.
15
COMP
Output of the internal error amplifier and control input to the PWM comparator. In isolated
applications, COMP is controlled by the secondary side error amplifier via an opto-coupler.
16
ARTN
PWM controller reference ground pin; should be shorted externally to the RTN pin as a
single point ground connection to improve noise immunity.
EP
Exposed metal pad on the underside of the device. It is recommended to connect this pad to
a PC Board plane connected to the VEE pin to improve heat dissipation.
www.national.com
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