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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.25)

(1.6)

(1.9)

6X (0.5)

(0.9)

(

0.2) VIA

TYP

(0.55)

8X (0.5)

(R0.05) TYP

WSON - 0.8 mm max height

DSG0008A

PLASTIC SMALL OUTLINE - NO LEAD

4218900/D 04/2020

SYMM

1

4

5

8

SCALE:20X

LAND PATTERN EXAMPLE

SYMM

9

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

SOLDER MASK DETAILS

DEFINED

(PREFERRED)

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OPA310, OPA2310, OPA4310

SBOSAA1 – APRIL 2022

Copyright © 2022 Texas Instruments Incorporated

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