EXAMPLE STENCIL DESIGN

4226416/B 04/2021

www.ti.com

B3QFN - 4.1 mm max height

RDL0020A

PLASTIC QUAD FLAT PACK- NO LEAD

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 17,18, 19 & 20 :

91% PRINTED SOLDER COVERAGE BY AREA

SCALE: 15X

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

1

PKG

4X (1.35)

4X (0.45)

10X (0.2)

10X (0.85)

10X (0.5)

(R0.05) TYP

(4.5)

(4)

2X (0.875)

2X (0.925)

(1.075) TYP

2X (0.538)

PKG

16

8

9

20

19

18

17

4X (1.53)

4X (0.825)