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LPC2102 데이터시트(PDF) 21 Page - NXP Semiconductors

부품명 LPC2102
상세설명  Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC
PDF  32 Pages
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제조업체  PHILIPS [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

LPC2102 데이터시트(HTML) 21 Page - NXP Semiconductors

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LPC2101_02_03_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 18 January 2006
21 of 32
Philips Semiconductors
LPC2101/2102/2103
Single-chip 16-bit/32-bit microcontrollers
7.
Limiting values
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Core and internal rail.
[3]
External rail.
[4]
On ADC related pins.
[5]
Including voltage on outputs in 3-state mode.
[6]
Only valid when the VDD(3V3) supply voltage is present.
[7]
Not to exceed 4.6 V.
[8]
Per supply pin.
[9]
The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(1V8)
supply voltage (1.8 V)
[2]
−0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
[3]
−0.5
+3.6
V
VDDA
analog 3.3 V pad supply voltage
−0.5
4.6
V
Vi(VBAT)
input voltage on pin VBAT
for the RTC
−0.5
4.6
V
VIA
analog input voltage
[4]
−0.5
5.1
V
VI
input voltage
5 V tolerant I/O
pins
[5] [6]
−0.5
6.0
V
other I/O pins
[5]
−0.5
VDD + 0.5 [7] V
IDD
supply current
[8] -
100 [9]
mA
ISS
ground current
[10] -
100 [9]
mA
Tstg
storage temperature
[11]
−40
125
°C
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
-
1.5
W



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