TSSOP−20 WB

CASE 948E

ISSUE D

DATE 17 FEB 2016

SCALE 2:1

DIM

A

MIN

MAX

MIN

MAX

INCHES

6.60

0.260

MILLIMETERS

B

4.30

4.50

0.169

0.177

C

1.20

0.047

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.65 BSC

0.026 BSC

H

0.27

0.37

0.011

0.015

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.19

0.30

0.007

0.012

K1

0.19

0.25

0.007

0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

_

___

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

110

11

20

PIN 1

IDENT

A

B

−T−

0.100 (0.004)

C

D

G

H

SECTION N−N

K

K1

JJ1

N

N

M

F

−W−

SEATING

PLANE

−V−

−U−

S

U

M

0.10 (0.004)

T

20X

REF

K

L

L/2

2X

S

U

0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40

0.252

---

---

S

U

0.15 (0.006) T

GENERIC

MARKING DIAGRAM*

XXXX

XXXX

ALYWG

G

7.06

16X

0.36

16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

(Note: Microdot may be in either location)

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ASH70169A

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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