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15

Analog Technologies

ATLS25A219D

32V 25A Constant Current Laser Driver

OUTLINE DIMENSIONS

The driver comes in 1 package: through hole mount, or so-called DIP (Dual Inline Package) or D (short for DIP) package.

Dimensions of the DIP package driver are shown in Figure 19.

Figure 19. Dimensions of the DIP Package Driver

Figure 20. End View of the PCB Foot-print

Figure 20 shows the foot-print which is seen from the end

side of the PCB.

“Tent” all the vias under the driver, i.e. cover the entire

via by the solder mask layer, otherwise the vias can be

shorted by the bottom plate of the driver which is

internally connected the ground.

See Figures 19, it is recommended to use large copper fills

for VPS, PGLDC, and the LDA pins, and other pins if

possible, to decrease the thermal resistance between the

module and the supporting PCB, to lower the module

temperature.

It is highly recommended to lower solder iron

temperature to 310°C (590°F) and solder the driver

manually, so that the internal contents of the driver would

not be affected.

After the soldering, it is also safe to check the laser driver’s

functionality by using the “dummy laser” before connecting

a real laser diode as mentioned previously on page 4.