TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com

Advance Product Information

November 6, 2001

Reflow process assembly notes:

•

AuSn (80/20) solder with limited exposure to temperatures at or above 300

ŒC

•

alloy station or conveyor furnace with reducing atmosphere

•

no fluxes should be utilized

•

coefficient of thermal expansion matching is critical for long-term reliability

•

storage in dry nitrogen atmosphere

Component placement and adhesive attachment assembly notes:

•

vacuum pencils and/or vacuum collets preferred method of pick up

•

avoidance of air bridges during placement

•

force impact critical during auto placement

•

organic attachment can be used in low-power applications

•

curing should be done in a convection oven; proper exhaust is a safety concern

•

microwave or radiant curing should not be used because of differential heating

•

coefficient of thermal expansion matching is critical

Interconnect process assembly notes:

•

thermosonic ball bonding is the preferred interconnect technique

•

force, time, and ultrasonics are critical parameters

•

aluminum wire should not be used

•

discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire

•

maximum stage temperature: 200

ŒC

Assembly Process Notes

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice.

5

TGA1319C-EPU