AD9744ARURL7 datasheet(31/32 Pages) AD

31 / 32 page

Data Sheet

AD9744

Rev. C | Page 31 of 32

Figure 60. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Options

AD9744AR

−40°C to +85°C

28-Lead, 300-Mil SOIC_W

RW-28

AD9744ARZ

−40°C to +85°C

28-Lead, 300-Mil SOIC_W

RW-28

AD9744ARZRL

−40°C to +85°C

28-Lead, 300-Mil SOIC_W

RW-28

AD9744ARU

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARURL7

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARUZ

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARUZRL7

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ACPZ

−40°C to +85°C

32-Lead LFCSP_WQ

CP-32-7

AD9744ACPZRL7

−40°C to +85°C

32-Lead LFCSP_WQ

CP-32-7

AD9744-EBZ

Evaluation Board (SOIC)

AD9744ACP-PCBZ

Evaluation Board (LFCSP)

Z = RoHS Compliant Part.

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

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