WSLP3921, WSLP5931

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Vishay Dale

Upgrade for TCR to Kelvin Termination With WSLP2726

Revision: 15-Jul-2022

3

Document Number: 30176

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

in the resistance element. It is recommended to follow common design practices for power semiconductors that ensure the junction

temperature is maintained with in thermal limits by using large pad surfaces, thermal vias, heavier copper weights, internal layers as well as

other thermal spreading features. The thermal resistance values provided function in the same manner as junction to terminal temperature

DERATING - AMBIENT TEMPERATURE

DERATING - TERMINAL TEMPERATURE

PULSE CAPABILITY

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GLOBAL MODEL

RESISTANCE VALUE

(m

Ω)

(°C/W)

“D” THICKNESS

(Inches)

ELEMENT MATERIAL

WSLP3921

0.1

0.9

0.0560

Mn-Cu-Sn

WSLP3921

0.2

2.7

0.0560

Mn-Cu-Sn

WSLP3921

0.3

3.8

0.0510

Mn-Cu

WSLP3921

0.4

4.3

0.0350

Mn-Cu

WSLP3921

0.5

5.8

0.0300

Mn-Cu

WSLP3921

0.7

6.3

0.0205

Mn-Cu

WSLP3921

1.0

10.9

0.0150

Mn-Cu

WSLP3921

1.5

8.3

0.0360

Fe-Cr

WSLP3921

2.0

12.0

0.0270

Fe-Cr

WSLP3921

3.0

20.7

0.0170

Fe-Cr

WSLP3921

4.0

22.8

0.0130

Fe-Cr

WSLP5931

0.1

1.6

0.0560

Mn-Cu-Sn

WSLP5931

0.2

2.4

0.0490

Mn-Cu

WSLP5931

0.3

3.5

0.0300

Mn-Cu

WSLP5931

0.5

5.7

0.0180

Mn-Cu

WSLP5931

1.0

7.2

0.0330

Fe-Cr

WSLP5931

2.0

13.2

0.0155

Fe-Cr

WSLP5931

3.0

19.3

0.0105

Fe-Cr

10

100

1000

10000

0

20

40

60

80

100

120

-65-55 -25

0

25 50

100 125 150 170

Axis Title

Ambient Temperature (°C)

70

10

100

1000

10000

0

20

40

60

80

100

120

0

20406080 100 120 140 160 180

Axis Title

T

Stability < 1.0 %

Stability < 0.5 %

IILLLL

US

TR

AT

AA

IVE

PU

RRPP

OS

EESS

O

ON

LYY

LLLL

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