FSUSB242UCX−Z002

www.onsemi.com

12

PACKAGE DIMENSIONS

WLCSP9, 1.2x1.2x0.48

CASE 567UL

ISSUE A

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 2009.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE SPHERICAL

CROWNS OF THE SOLDER BALLS.

DIM

A

MIN

NOM

0.450

MILLIMETERS

A1

D

E

b

0.24

0.26

e

0.40 BSC

0.488

D

E

A B

PIN A1

REFERENCE

A

0.05

B

C

0.03 C

0.05 C

9X

b

12

3

C

B

A

A

A1

C

0.176

0.196

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy

and soldering details, please download the

onsemi Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

RECOMMENDED

e

A2

1.14

1.20

1.14

1.20

A2

0.274

0.292

MAX

0.28

0.526

0.216

1.26

1.26

0.310

(NSMD PAD TYPE)

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