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MF-FSHT 데이터시트(PDF) 3 Page - Bourns Electronic Solutions |
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MF-FSHT 데이터시트(HTML) 3 Page - Bourns Electronic Solutions |
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3 / 6 page ![]() MF-FSHT Series – PTC Resettable Fuses Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. How to Order MF - FSHT 005 K X - 2 Multifuse® Product Designator Series FSHT = 0603 High Temperature Surface Mount Component Hold Current, Ihold 005 - 016 (0.05 - 0.16 Amps) K = Material Specific Code X = Multifuse® freeXpansion™ Design Packaging -2 = Tape and Reel Packaged per EIA-481 Typical Part Marking No marking Packaging Quantity 5,000 pieces per reel Solder Reflow Recommendations TP TP tp t s TTO RAMP-UP L TL t L 25 Ts max Ts min PREHEAT Time CRITICAL ZONE RAMP-DOWN t 25 °C TO PEAK Notes: • MF-FSHT models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200 °C 60~180 seconds TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) 217 °C 60~150 seconds Peak Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. |
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