| 전자부품 데이터시트 검색엔진 |
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MF-USHT 데이터시트(PDF) 3 Page - Bourns Electronic Solutions |
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MF-USHT 데이터시트(HTML) 3 Page - Bourns Electronic Solutions |
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3 / 7 page ![]() MF-USHT Series - PTC Resettable Fuses Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Packaging Quantity MF-USHT010KX ~ MF-USHT075KX............. 3000 pcs. per reel MF-USHT110KX ~ MF-USHT150KX............. 2000 pcs. per reel How to Order MF - USHT 050 K X - 2 Multifuse® Product Designator Series USHT = 1210 High Temperature Surface Mount Component Hold Current, Ihold 010 - 150 (0.10 - 1.50 Amps) Material Specific Code Multifuse® freeXpansion™ Design Packaging -2 = Tape and Reel Packaged per EIA-481 Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION: MF-USHT010KX = B MF-USHT016KX = D MF-USHT020KX = E MF-USHT035KX = F MF-USHT050KX = K MF-USHT075KX = L MF-USHT110KX = N MF-USHT125KX = P MF-USHT150KX = S BIWEEKLY DATE CODE: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z K C Solder Reflow Recommendations Notes: • MF-USHT models are intended for reflow soldering (including, but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. • Hand soldering is not recommended for these devices. • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. TP TP tp t s TTO RAMP-UP L TL t L 25 Ts max Ts min PREHEAT Time CRITICAL ZONE RAMP-DOWN t 25 °C TO PEAK Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 °C 200 °C 60~180 seconds TIME MAINTAINED ABOVE: Temperature (TL) Time (tL) 217 °C 60~150 seconds Peak Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds Ramp-Down Rate 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. |
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