| 전자부품 데이터시트 검색엔진 |
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HT36F2 데이터시트(PDF) 35 Page - Holtek Semiconductor Inc |
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HT36F2 데이터시트(HTML) 35 Page - Holtek Semiconductor Inc |
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35 / 36 page ![]() Carrier Tape Dimensions SOP 16W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 16 ±0.2 P Cavity Pitch 12 ±0.1 E Perforation Position 1.75 ±0.1 F Cavity to Perforation (Width Direction) 7.5 ±0.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4 ±0.1 P1 Cavity to Perforation (Length Direction) 2 ±0.1 A0 Cavity Length 10.9 ±0.1 B0 Cavity Width 10.8 ±0.1 K0 Cavity Depth 3 ±0.1 t Carrier Tape Thickness 0.3 ±0.05 C Cover Tape Width 13.3 SOP 28W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 24 ±0.3 P Cavity Pitch 12 ±0.1 E Perforation Position 1.75 ±0.1 F Cavity to Perforation (Width Direction) 11.5 ±0.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4 ±0.1 P1 Cavity to Perforation (Length Direction) 2 ±0.1 A0 Cavity Length 10.85 ±0.1 B0 Cavity Width 18.34 ±0.1 K0 Cavity Depth 2.97 ±0.1 t Carrier Tape Thickness 0.35 ±0.01 C Cover Tape Width 21.3 HT36F2 Rev. 1.00 35 August 15, 2005 P D 1 W P 1 P 0 D E F t K 0 B 0 A 0 C |
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