전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

SF-0603SPA-R 데이터시트(PDF) 4 Page - Bourns Electronic Solutions

부품명 SF-0603SPA-R
상세설명  SF-0603SPA-R SeriesAutomotive Grade SMD Fuses
PDF  5 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  BOURNS [Bourns Electronic Solutions]
홈페이지  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

SF-0603SPA-R 데이터시트(HTML) 4 Page - Bourns Electronic Solutions

  SF-0603SPA-R Datasheet HTML 1Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 2Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 3Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 4Page - Bourns Electronic Solutions SF-0603SPA-R Datasheet HTML 5Page - Bourns Electronic Solutions  
Zoom Inzoom in Zoom Outzoom out
 4 / 5 page
background image
Solder Reflow Recommendations
Profile Feature
Pb-Free Assembly
Preheat / Soak:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (ts) from (Tsmin to Tsmax)
150 °C
200 °C
60~120 seconds
Ramp Up Rate (TL to Tp)
3 °C / second max.
Liquidous Temperature (TL)
Time (tL) maintained above TL
217 °C
60~150 seconds
Peak Package Body
Temperature (Tp)
260 °C
Time (tp)* within 5 °C of the
specified classification temperature (Tc) 30 seconds*
Ramp Down Rate (Tp to TL)
6 °C / second max.
Time 25 °C to Peak Temperature
8 minutes max.
TIME
tL
TIME 25 °C TO PEAK
tp
ts
Tsmax
Tsmin
Tp
260
150
10 sec. max.
PREHEATING
TL
25
Tc -5 °C
PREHEAT AREA
MAX. RAMP UP RATE = 3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
120 seconds
TIME
* Tolerance for peak profile temperature (Tp) is defined as a
supplier minimum and a user maximum.
SF-0603SPA-R Series – Automotive Grade SMD Fuses
Test Items
Reference Standard
Solderability
J-STD-002; Condition B
Resistance to Soldering Heat
MIL-STD-202; Method 210;
Condition B
Moisture Resistance
MIL-STD-202; Method 106
Thermal Shock
MIL-STD-202; Method 107;
Condition B
Mechanical Shock
MIL-STD-202; Method 213;
Condition A
Vibration
MIL-STD-202; Method 201
Terminal Strength
IEC 60115-1 4.32
High Temperature Storage
MIL-STD-202; Method 108
Temperature Cycling
JESD22 Method JA-104,
Test Conditions B and N
Bias Humidity
MIL-STD-202; Method 103
Operational Life
MIL-STD-202; Method 108;
Condition D
Resistance to Solvent
MIL-STD-202; Method 215
Board Flex (Bending)
AEC-Q200-005
Carrying Capacity
UL 248-14
Fusing Time
UL 248-14
Interrupting Ability
UL 248-14
Temperature Rise
UL 248-14
Residual Resistance
UL 248-14
Low Temperature Storage
JESD22-A119
Reliability Tests
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
03/22



Html Pages

1 2 3 4 5


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com