3

SY89832U

Micrel, Inc.

M9999-092005

hbwhelp@micrel.com or (408) 955-1690

September 2005

Supply Voltage (V

Input Voltage (V

LVDS Output Current (I

Input Current

Source or Sink Current on (IN, /IN) ..................

±50mA

VREF-AC Current

Source or Sink Current on (I

Lead Temperature (soldering, 20sec.) ...................... 260

°C

Storage Temperature (T

Supply Voltage Range .......................... +2.375V to 2.625V

Ambient Temperature (T

MLF™

(θ

(ψ

T

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

CC

Power Supply

2.375

2.5

2.625

V

I

CC

Power Supply Current

No load, max. V

75

100

mA

R

IN

Input Resistance (IN-to-VT)

45

50

55

Ω

R

DIFF-IN

Differential Input Resistance

(IN-to-/IN)

80

100

120

Ω

V

IH

Input HIGH Voltage (IN, /IN)

Note 5

V

V

CC

V

V

IL

Input LOW Voltage (IN, /IN)

0

V

V

V

IN

Input Voltage Swing (IN, /IN)

see Figure 2c.

0.1

1.7

V

V

DIFF_IN

Differential Input Voltage Swing

|IN – /IN|

see Figure 2d.

0.2

V

V

REF–AC

Output Reference Voltage

V

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

ψ

are determined for a 4-layer board in stil-air number, unless otherrwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

5. V