| 전자부품 데이터시트 검색엔진 |
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CB3JB3K32 데이터시트(PDF) 3 Page - Stackpole Electronics, Inc. |
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CB3JB3K32 데이터시트(HTML) 3 Page - Stackpole Electronics, Inc. |
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3 / 4 page ![]() Rev Date: 4/13/2021 3 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use. CB / MCB Series Ceramic Housed with Axial Leads Power Resistor Stackpole Electronics, Inc. Resistive Product Solutions RoHS Compliance Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances” (RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as amended by Directive (EU) 2015/863/EU as regards the list of restricted substances. RoHS Compliance Status CB General Purpose Ceramic Housed with Axial Leads Wirewound Resistor Axial YES 100% Matte Sn Jan-06 06/01 MCB Ceramic Housed General Purpose Metal Oxide Element Resistor Axial YES 100% Matte Sn Jan-06 06/01 Lead-Free Effective Date Code (YY/WW) Standard Product Series Description Package / Termination Type Standard Series RoHS Compliant Lead-Free Termination Composition Lead-Free Mfg. Effective Date (Std Product Series) Recommended Lead Free Resistor Reflow Profile Wave Soldering Description Maximum Recommended Minimum Preheat Time 80 seconds 70 seconds 60 seconds Temperature Diff. 140°C 120°C 100°C Solder Temp. 260°C 250°C 240°C Dwell Time at Max. 10 seconds 5 seconds * Ramp DN (°C/sec) N/A N/A N/A Temperature Diff. = Defference between final preheat stage and soldering stage. Convection IR Reflow Description Maximum Recommended Minimum Ramp Up (°C/sec) 3°C/sec 2°C/sec * Dwell Time > 217°C 150 seconds 90 seconds 60 seconds Solder Temp. 260°C 245°C * Dwell Time at Max. 30 seconds 15 seconds 10 seconds Ramp DN (°C/sec) 6°C/sec 3°C/sec * |
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