TDA75610S-QLX datasheet(24/42 Pages) STMICROELECTRONICS

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Thermal protection

TDA75610SLV

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DocID025599 Rev 6

Thermal protection

Thermal protection is implemented through thermal foldback (Figure 33).

Thermal foldback begins limiting the audio input to the amplifier stage as the junction

temperatures rise above the normal operating range. This effectively limits the output power

capability of the device thus reducing the temperature to acceptable levels without totally

interrupting the operation of the device.

The output power will decrease to the point at which thermal equilibrium is reached.

Thermal equilibrium will be reached when the reduction in output power reduces the

dissipated power such that the die temperature falls below the thermal foldback threshold.

Should the device cool, the audio level will increase until a new thermal equilibrium is

reached or the amplifier reaches full power. Thermal foldback will reduce the audio output

level in a linear manner.

Three thermal warnings are available through the I2C bus data. After thermal shut down

threshold is reached, the CD could toggle (as shown in Figure 33) or stay low, depending on

signal level.

Figure 33. Thermal foldback diagram

6.1

Fast muting

The muting time can be shortened to less than 1.5 ms by setting (IB2) D5 = 1. This option

can be useful in transient battery situations (i.e. during car engine cranking) to quickly

turnoff the amplifier to avoid any audible effects caused by noise/transients being injected

by preamp stages. The bit must be set back to “0” shortly after the mute transition.

TDA75610S-QLX 데이터시트(PDF) 24 Page - STMicroelectronics