TDA7707 datasheet(3/7 Pages) STMICROELECTRONICS

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Electrical specification

2.1

Absolute maximum ratings

Table 1. Absolute maximum ratings

Symbol

Parameter

Test condition

Min Typ Max

Units

VCC

Abs. supply voltage

-0.5

3.6

Tstg

Storage temperature

-55

150

°C

VESD

ESD absolute minimum withstand voltage

Human Body model

>|±2000|(1)

Charged device model

>|±500|(2)

Charged device model, corner pins

>|±750|

Max. input current at any pin

(latch-up characteristic)

IINMAX

±100

1. |±1000| on AM_IN pin

2. |±400| on AM_IN pin

2.2

Thermal data

Table 2. Thermal data

Symbol

Parameter

Test Condition

Value

Units

Rth j-amb Thermal Resistance junction-to-ambient

Multilayer 2s2p as per JEDEC JESD51-7

°C / W

Thermally optimized multilayer 2s2p board

2.3

General key parameters

Table 3. General key parameters

Symbol

Parameter

Test Condition

Min Typ Max Units

VCC

3.3 V supply voltage

3.15 3.3 3.45

ICC

Supply current

Two active RF channels, VCC = 3.45 V

519

Two active RF channels, JESD204b interface activated

(10 pF load), VCC = 3.45 V

600

Tamb

Ambient Temperature Range -

-40

°C

Tj_oper Operative Junction Temp

125

°C

Pdiss

Dissipated power

Two active RF channels, Rext = 9 Ohm, I2S baseband

interface activated

1.5

Two active RF channels, Rext = 7.5 Ohm, JESD204b

interface activated

1.7

TDA7707

Electrical specification

DB2481 - Rev 3

page 3/7

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