8.5

Pb-free solder reflow process

The table and figure below show the recommended and maximum values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste and material used. We expect

customers to follow the “recommended” reflow profile, which is specifically tuned for the VL53L5CX package.

For any reason, if a customer must perform a reflow profile which is different from the “recommended” one

(especially peak >240 °C), the new profile must be qualified by the customer at their own risk. In any case, the

profile has to be within the “maximum” profile limit described in the table below.

Parameters

Recommended

Maximum

Units

130

200

90-110

150

200

60-120

°C

°C

s

Ramp up

217

55-65

2

217

55-65

3

°C

s

°C/s

Ramp up

—

—

—

235

10

3

°C

s

°C/s

240

260

°C

Time to peak

300

300

s

-4

-6

°C/s

Note:

The component should be limited to a maximum of three passes through this solder profile.

Note:

As the VL53L5CX package is not sealed, only a dry reflow process should be used (such as convection reflow).

Vapor phase reflow is not suitable for this type of optical component.

Note:

The VL53L5CX is an optical component and as such, it should be treated carefully. This would typically include

using a ‘no-wash’ assembly process.

VL53L5CX

Pb-free solder reflow process

DS13754 - Rev 8

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