Pin Name

D1

D2

D3

D4

Pin Name

D1

D2

D3

D4

NC (pins 1, 5, 9)

x

x

x

T_CRIT_A

x

V

CC

x

SMBData

x

x

D+

x

x

x

NC (pin 13)

x

x

D−

x

x

x

SMBCLK

x

ADD0, ADD1

x

x

x

NC (pin 16)

x

Note: An x indicates that the diode exists.

Note 3: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National

Semiconductor Linear Data Book for other methods of soldering surface mount devices.

Note 4: Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin.

Note 5: Thermal resistance of the QSOP-16 package is 130˚C/W, junction-to-ambient when attached to a printed circuit board with 2 oz. foil.

Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 10: Quiescent current will not increase substantially with an active SMBus.

Note 11: This specification is provided only to indicate how often temperature data is updated. The LM91 can be read at any time without regard to conversion state

(and will yield last conversion result).

state of an SMBus communication (SMBCLK and SMBData set High).

20034308

FIGURE 1. ESD Protection Input Structure

20034305

FIGURE 2. Temperature-to-Digital Transfer Function (Non-linear scale for clarity)

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