t

KTZ8866

January 2022 - Revision 04b

Page 37 of 37

Company Confidential

Packaging Information

WLCSP47-28 (1.730mm x 2.920mm x 0.620mm)

0.400mm

Typ.

0.400mm

Typ.

28x

0.27mm Ø

±0.027mm

1.730mm

±0.050mm

2.920mm

±0.050mm

0.215mm

±0.022mm

0.620mm

±0.045mm

0.025mm

±0.003mm

Bottom View

Side View

Top View

Top Side Die Coating

A1 Corner

Recommended Footprint

0.40mm

0.40mm

1.20mm

2.40mm

0.32mm

Solder Mask

Opening

0.22mm

Copper Pad

Diameter

(NSMD Pad Type)

Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies

product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and

specifications without notice at any time.