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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ST25R3916 데이터시트(PDF) 152 Page - STMicroelectronics |
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ST25R3916 데이터시트(HTML) 152 Page - STMicroelectronics |
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152 / 157 page  Package information ST25R3916/7 152/157 DS12484 Rev 4 6.2 WLCSP36 package information WLCSP36 is a 36-ball, 3.213x3.203 mm, 0.5 mm pitch, wafer level chip scale package. Figure 38. WLCSP36 outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 135. WLCSP36 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.550 0.590 0.630 0.0217 0.0232 0.0248 A1 - 0.235 - - 0.0093 - A2 - 0.330 - - 0.013 - A3(2) - 0.025 - - 0.001 - b - 0.330 - - 0.013 - D 3.193 3.213 3.233 0.1257 0.1265 0.1273 E 3.183 3.203 3.223 0.1253 0.1261 0.1269 e - 0.500 - - 0.0197 - e1 - 2.500 - - 0.0984 - F - 0.347 - - 0.0137 - B078_WLCSP36_ME_V1 Y Z e1 e e e1 F G 1 2 3 4 5 6 A B C D E F Orientation reference BOTTOM VIEW b A1 A3 A2 A DETAIL A SIDE VIEW X aaa (2X) D E aaa (2X) TOP VIEW Orientation reference eee b (36x) Z ccc ddd M M Z Z XY DETAIL A A1 Seating plane |
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