AM486DX2 datasheet(65/67 Pages) AMD

65 / 67 page

Am5X86 Microprocessor

AMD

PRELIMINARY

PACKAGE THERMAL

SPECIFICATIONS

The Am5X86 microprocessor is specified for operation

when TCASE (the case temperature) is within the range

of 0

°C to +55°C or +85°C. T

CASE can be measured in

any environment to determine whether the Am5X86 mi-

croprocessor is within specified operating range. The

case temperature should be measured at the center of

the top surface opposite the pins.

The ambient temperature (TA) is guaranteed if TCASE is

not violated. The ambient temperature can be calculated

from

JC and θJA and from the following equations:

TJ = TCASE + (P • θJC)

TA = TJ – (P • θJA)

TCASE = TA + (P • [θJA – θJC])

Where:

TJ, TA, TCASE = Junction, Ambient, and Case Temperature

JC, θJA

= Junction-to-Case and Junction-to-Ambient

Thermal Resistance, respectively

= Maximum Power Consumption

The values for

JA and θJC are given in Table 21 for the

1.75 sq. in., 168-pin, ceramic PGA. For the 208-pin

SQFP plastic package,

JA = 14.0 and θJC = 1.5.

Table 22 shows the T

A allowable (without exceeding

CASE) at various airflows and TCASE values for the PGA

package. Note that T

A is greatly improved by attaching

a heat sink to the package. P (the maximum power con-

sumption) is calculated by using a maximum I

CC value

of 931 mA at 3.3 V. Table 23 shows the T

A allowable

(without exceeding T

CASE) for the SQFP package using

a maximum I

CC value of 931 mA at 3.3 V.

Note:

*0.350

″ high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing)

Table 21. Thermal Resistance (°C/W)

JC and θJA for the Am5

X86 CPU in 168-Pin PGA Package

Cooling

Mechanism

JA vs. Airflow-Linear ft/min. (m/s)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.07)

No Heat Sink

1.5

16.5

14.0

12.0

10.5

9.5

9.0

Heat Sink*

2.0

12.0

7.0

5.0

4.0

3.5

3.25

Heat Sink* and fan

2.0

5.0

4.6

4.2

3.8

3.5

3.25

Table 22. Maximum T

A at Various Airflows in °C

TA by Cooling Type

TCASE

Clock

Airflow-Linear ft/min. (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.07)

TA without Heat Sink

°C

133 MHz

8.9

°C

16.6

°C

22.7

°C

27.3

°C

30.4

°C

32.0

°C

TA with Heat Sink

°C

133 MHz

24.3

°C

39.6

°C

45.8

°C

48.9

°C

50.4

°C

51.2

°C

TA with Heat Sink and fan

°C

133 MHz

45.8

°C

47.0

°C

48.2

°C

49.5

°C

50.4

°C

51.2

°C

TA without Heat Sink

°C

133 MHz

38.9

°C

46.6

°C

52.7

°C

57.3

°C

60.4

°C

62.0

°C

TA with Heat Sink

°C

133 MHz

54.3

°C

69.6

°C

75.8

°C

78.9

°C

80.4

°C

81.2

°C

TA with Heat Sink and fan

°C

133 MHz

75.8

°C

77.0

°C

78.2

°C

79.5

°C

80.4

°C

81.2

°C

Table 23. Maximum T

A for SQFP Package by Clock Frequency

TCASE

Clock

°C

133 MHz

46.6

°C

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