CF5012 series

NIPPON PRECISION CIRCUITS INC.—2

PAD LAYOUT

(Unit:

µm)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 0.92

× 1.18 mm

Chip thickness: 300 ± 30 µm

Name

I/O

Description

Pad dimensions [µm]

XY

INHN

I

Output state control input. High impedance when LOW. Pull-up resistor built in

195

174.4

XT

I

Amplifier input

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XTN

385

174.4

XTN

O

Amplifier output

575

174.4

VSS

–

Ground

765

174.4

Q

O

Output. Output frequency. High impedance in standby mode

757.6

1017.6

VDD

–

Supply voltage

165.4

1014.6

Q

VDD

XT

VSS

(0,0)

(920,1180)

X

Y

INHN

XTN

HA5012ANB

XT

VSS

VDD

Q

XTN

INHN