M28R400CT-KGD, M28R400CB-KGD

6/11

Table 8. Pad Extraction

Note: 1. All pad placements are referred to the center of the chip and center of the pad. The coordinates can be used to operate wire bonding

equipment.

2. NC = Pad not connected.

3. Dimensions are given in microns.

Pad

Number

Pad

Function

Pad Placement

Pad

Number

Pad

Function

Pad Placement

XY

XY

1

A15

–1612.24

1068.60

24

1385.72

–1023.68

2

A14

–1477.72

1068.60

25

G

1266.60

–1023.68

3

A13

–1315.88

1068.60

26

DQ0

1141.00

–1023.68

4

A12

–1190.28

1068.60

27

DQ8

1008.92

–1023.68

5

A11

–1071.16

1068.60

28

DQ1

889.80

–1023.68

6

A10

–945.56

1068.60

29

DQ9

757.72

–1023.68

7

A9

–783.72

1068.60

30

DQ2

638.80

–1023.68

8

A8

–658.12

1068.60

31

DQ10

506.52

–1023.68

9W

–539.00

1068.60

32

DQ3

387.40

–1023.68

10

RP

–377.16

1068.60

33

DQ11

255.32

–1023.68

11

249.16

1068.60

34

136.20

–1023.68

12

WP

374.76

1068.60

35

DQ4

–255.08

–1023.68

13

NC

536.60

1068.60

36

DQ12

–387.16

–1023.68

14

A17

655.72

1068.60

37

DQ5

–506.28

–1023.68

15

A7

781.32

1068.60

38

DQ13

–638.36

–1023.68

16

A6

943.16

1068.60

39

DQ6

–757.48

–1023.68

17

A5

1068.76

1068.60

40

DQ14

–889.56

–1023.68

18

A4

1187.88

1068.60

41

DQ7

–1008.68

–1023.68

19

A3

1313.48

1068.60

42

DQ15

–1140.76

–1023.68

20

A2

1475.32

1068.60

43

NC

–1266.36

–1023.68

21

A1

1609.84

1068.60

44

–1385.48

–1023.68

22

A0

1636.92

–1023.68

45

–1504.60

–1023.68

23

E

1504.84

–1023.68

46

A16

–1636.68

–1023.68