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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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HAL501 데이터시트(PDF) 6 Page - Micronas |
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HAL501 데이터시트(HTML) 6 Page - Micronas |
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6 / 48 page  HAL 5xy DATA SHEET 6 April 15. 2010; DSH000020_004EN Micronas 1.6. Solderability and Welding Soldering During soldering reflow processing and manual reworking, a component body temperature of 260 °C should not be exceeded. Welding Device terminals should be compatible with laser and resistance welding. Please note that the success of the welding process is subject to different welding parameters which will vary according to the welding technique used. A very close control of the welding parameters is absolutely necessary in order to reach satisfying results. Micronas, therefore, does not give any implied or express warranty as to the ability to weld the component. Fig. 1–1: Pin configuration 1 VDD 2, 4 GND 3 OUT |
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