AS1744, AS1745

Data Sheet

www.austriamicrosystems.com

Revision 1.53

2 - 16

4 Absolute Maximum Ratings

Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical

Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Limit forward-diode current to the maximum current rating.

Table 1. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

V+, IN1, IN2 to GND

-0.3

+7

V

COMx, NOx, NCx to GND

†

-0.3

V+

+ 0.3

V

COMx, NOx, NCx Continuous Current

-100

+100

mA

COMx, NOx, NCx Peak Current

-150

+150

mA

Pulsed at 1ms, 10% duty cycle

330

mW

Derate at 4.7mW/ºC above +70ºC

Electro-Static Discharge

1000

V

HBM Mil-Std883E 3015.7

methods

Latch Up Immunity

100

mA

Norm: JEDEC 17

Operating Temperature Range

-40

+85

ºC

Junction Temperature

150

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020C “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”