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NCC5003JB 데이터시트(PDF) 1 Page - California Micro Devices Corp

부품명 NCC5003JB
상세설명  BUSSED RESISTOR NETWORK
PDF  1 Pages
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제조업체  CALMIRCO [California Micro Devices Corp]
홈페이지  http://www.calmicro.com
Logo CALMIRCO - California Micro Devices Corp

NCC5003JB 데이터시트(HTML) 1 Page - California Micro Devices Corp

  NCC5003JB Datasheet HTML 1Page - California Micro Devices Corp  
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© 2000 California Micro Devices Corp. All rights reserved.
6/2/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
1
CALIFORNIA MICRO DEVICES
NCC
BUSSED RESISTOR NETWORK
California Micro Devices’ resistor arrays are the hybrid
equivalent to the bussed resistor networks available in
surface-mount packages. The resistors are spaced on
ten mil centers resulting in reduced real estate. These
C0970500
STANDARD NETWORK SCHEMATIC DIAGRAM
chips are manufactured using advanced thin film
processing techniques and are 100% electrically
tested and visually inspected.
R1
R4
R2
R5
R7
R3
R6
R8
60
90
N
O
I
T
A
N
G
I
S
E
D
R
E
B
M
U
N
T
R
A
P
C
C
N
3
0
0
5F
A
G
W
P
s
e
i
r
e
Se
u
l
a
Ve
c
n
a
r
e
l
o
TR
C
Ts
d
a
P
d
n
o
Bg
n
i
k
c
a
B
o
i
t
a
R
e
c
n
a
r
e
l
o
T
e
r
a
s
t
i
g
i
d
3
t
s
r
i
F%
5
.
0
±
=
Dm
p
p
0
0
1
±
=
r
e
t
t
e
L
o
Nd
l
o
G
=
Gd
l
o
G
=
W%
1
=
r
e
t
t
e
L
o
N
.
e
u
l
a
v
t
n
a
c
i
f
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n
g
i
s%
1
±
=
Fm
p
p
0
5
±
=
Am
u
n
i
m
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l
A
=
r
e
t
t
e
L
o
Nd
e
p
p
a
L
=
L%
5
.
0
=
P
-
s
e
r
p
e
r
t
i
g
i
d
t
s
a
L%
2
±
=
Gm
p
p
5
2
±
=
Br
e
h
ti
E
=
r
e
t
t
e
L
o
N
f
o
r
e
b
m
u
n
s
t
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e
s%
5
±
=
J
s
e
t
a
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n
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R
.
s
o
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z%
0
1
±
=
K
.
t
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p
l
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m
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c
e
d%
0
2
±
=
M
S
N
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T
A
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E
P
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L
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t
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e
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R
C
TC
°
5
2
1
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C
°
5
5
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/
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p
p
0
0
1
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e
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5
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0
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)
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(
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)
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°
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7
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m
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k
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TF
2
0
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T
S
-
L
I
M
7
0
1
d
o
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e
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%
5
2
.
0
±
∆Rx
a
M
e
r
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o
p
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e
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s
r
H
0
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1%
5
2
.
0
±
∆Rx
a
M
e
r
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t
s
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o
MF
2
0
2
-
D
T
S
-
L
I
M
6
0
1
d
o
h
t
e
M%
5
.
0
±
∆Rx
a
M
e
f
i
L
)
r
h
0
0
0
1
/
C
°
5
2
1
(
F
2
0
2
-
D
T
S
-
L
I
M
8
0
1
d
o
h
t
e
M%
5
.
0
±
∆Rx
a
M
e
s
i
o
NF
2
0
2
-
D
T
S
-
L
I
M
8
0
3
d
o
h
t
e
MB
d
5
3
–x
a
M
≥
k
0
5
2
Ω
B
d
0
3
–x
a
M
d
a
o
l
r
e
v
O
e
m
i
T
t
r
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h
S1
0
4
3
8
-
R
-
L
I
M%
5
2
.
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a
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e
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n
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t
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n
o
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t
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l
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n
IC
°
5
2
@0
1
x
1
2
1 Ω
.
n
i
M
S
N
O
I
T
A
C
I
F
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C
E
P
S
L
A
C
I
N
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H
C
E
M
e
t
a
r
t
s
b
u
Sk
c
i
h
t
s
li
m
2
±
0
1
n
o
c
il
i
S
r
e
y
a
L
n
o
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t
a
l
o
s
In
i
m
,
k
c
i
h
t
Å
0
0
0
,
0
1
2
0
i
S
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n
i
k
c
a
B)
l
a
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o
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t
p
o
d
l
o
g
(
d
e
p
p
a
L
n
o
i
t
a
z
il
a
t
e
Mn
i
m
,
k
c
i
h
t
Å
0
0
0
,
0
1
m
u
n
i
m
u
l
A
)
l
a
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t
p
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Å
0
0
0
,
5
1
(
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N
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V
0
0
1
m
o
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f
s
r
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t
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e
r
8
Ω
K
0
0
5
o
t
Ω
G
N
I
G
A
K
C
A
P
.
d
r
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6
9
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.
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R
.
1
Formats
Die Size: 90±3 x 60±3 mils
Bonding Pads: 5x7 mils typical


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